Chenbro Strategic Channel Alliance for Future Datacenter Solution in Computex 2015 & CGCC
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Taipei Computex 2015 was held during 6/2 – 6/6 this year. As the 3rd time participation in this Asian No.1 ICT exhibition, Chenbro has received great amount of positive feedbacks from customers this year by showcasing its new high density storage and datacenter server series at booth. On 6/3, Chenbro also successfully hosted its 2015 Global Channel Conference, along with its business alliance partners Intel, WD and Silicom at Taipei W Hotel.
Computex 2015: 4 categories of new products covering solutions of Appliance, Enterprise, Hyperscale Datacenter and Storage
Chenbro has showcased four categories of products this year – appliance server solutions, enterprise edge solutions, hyperscale datacenter solutions and high density storage solutions – at its booth in Computex. These products demonstrate combinations and applications of Chenbro’s professional technological capabilities in mechanics, electronics, software simulation, and system validation.
Customers have showed great interest in Chenbro upcoming products provided with valuable feedbacks including 12’’ compact appliance solution and 4U 48-BAY, 60-BAY high density storage solution. “As one of the leading companies in the industry, Chenbro’s R&D engineering team strives to make breakthroughs on technology innovation in order to satisfy new market trend. Our goal is to provide customers with the right solutions instead of the pricy solutions. How to decrease the TCO of our new solutions is one of the key considerations in our product development plan.” Commented by Eric Hui, Chenbro Corporate Marketing Director, when talking about Chenbro’s upcoming solutions under development. He also anticipates both of these two solutions will launch in the second half of this year.
Chenbro Global Channel Conference: Alliance partnership with Intel
On 6/3/2015, Chenbro hosted its annually Global Channel Conference at Taipei W Hotel. This main topic about this year’s conference is “Alliance partnership with Intel & co-explore the business opportunities in future data center market along with channel customers”. Intel PCSD Vice President and General Manager Al Diaz, Intel PCSD Business Development Manager Bruce Billo, WD Business Unit Manager Ted Deffenbaugh, Silicom Technical Director Eyal Cohen have been invited into the conference as the guest speakers to share their thoughts of the fast changing data center market trend. In total, 75 guests from 41 Chenbro’s channel customer companies attended the conference and cocktail party & dinner later hosted by Chenbro Chairman Maggi Chen.
During the conference, Intel Business Development Manager, Bruce Billo announced the partnership proposal with Chenbro to co-develop future solutions with Intel upcoming S1200RP & S2600CW server boards. Silicom also demonstrates the prototype SDN solution developed with Chenbro. All of the Chenbro channel customers revealed their anticipation and excitement for this business partnership. “As one of the biggest customers in China, we are looking forward to seeing Chenbro to launch its next generation solutions supported by Intel motherboard with high compatibility and world-class technical support.” Commented by Frank Ma, the CEO of Powerleader, one of the biggest SI companies in China.
